Bostik Laybond Wood is a filled solution of synthetic polymer resins in a blend of solvents which is formulated to a trowelling consistency.
It is ideal for bonding all types of parquet flooring, woodblock and woodstrip to strong subfloors including concrete, cementitious screeds, flooring grade plywood, chipboard, hardboard, and smoothing compounds. It is of particular use where the nature of the wood flooring makes it particularly prone to warping when bonded with waterborne adhesives.
Bostik Laybond Wood is suitable for use with warm water underfloor heating installations (surface temperature must not exceed 27°C). Heating systems must be switched off for 48 hours before and after installation.
Specification Details for Bostik Laybond Wood (Bonding Agents)
Please note that these product properties are not a replacement for the manufacturer's literature and it is always recommended that Bostik is consulted before specifying.
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